EP21FL Epoxy System
HACKENSACK, N.J., March 15, 2010 – Master Bond Inc.’s is a two-part epoxy resin system that features low to moderate viscosity. It is suitable for potting, coating and sealing electronic assemblies and for bonding dissimilar substrates with different coefficients of expansion.
Typical viscosity of Part A (clear) is 4000 cyles/s and, of Part B (amber), 10,000 cycles/s, at 25 ºC. The system produces strong castings, bonds and seals that are resistant to thermal cycling and shock. Its bond strength is >1500...
Master Bond Inc.