NSX 320 Metrology System
FLANDERS, N.J., Aug. 7, 2013 — Rudolph Technologies Inc. has released three application-specific configurations of its NSX 320 automated macro-defect inspection system for wafer-level packaging, 2.5D interposers and 3DICs (3-D integrated circuits) using through-silicon via as interconnects.
The system measures film thickness (polymers, photoresist, glass), thin remaining silicon thickness, surface topography, and copper pillar and solder bump height. The advanced wafer-level packaging configuration adds measurements of...
Rudolph Technologies Inc.