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flip chip News
Brilliance Lands Investment from PhotonVentures and Oost NL
ENSCHEDE, Netherlands, Dec. 6, 2023 — Netherlands-based integrated laser technology startup company Brilliance has secured €2 million ($2.16 million) in seed funding from Oost NL and PhotonVentures. Brilliance’s silicon nitride-based PIC technology address the limitations of...
VCSEL Advancements Power 3D Sensing
Jun 10, 2021 — iStock.com/NeoLeo An innovative VCSEL design, featuring multiple active regions separated by tunnel junctions, boosts efficiency and output power while optimizing beam divergence. The emergence of 3D sensing in the consumer, industrial, and...
Indium’s Andy Mackie Joins Editorial Board
Oct 15, 2008 — Indium Corp. announced that its semiconductor assembly materials product manager, Dr. Andy C. Mackie, has joined the editorial board of Chip Scale Review, a magazine covering the chip-scale, flip chip, and wafer-level packaging market. Mackie has...
Nextreme Hires Stephen Brooks as Director of Manufacturing
Nov 8, 2007 — Nextreme Thermal Solutions Inc., a Research Triangle Park, N.C.-based manufacturer of microscale thermal and power management products for the electronics industry, has named Stephen Brooks as director of manufacturing. Brooks will coordinate the...
Patrick Tang Joins Surfect as VP Asia
Jul 27, 2007 — Surfect Technologies Inc. of Albuquerque, N.M., provider of a single-cell electroplating tool and process solution to the semiconductor industry, announced this week it has named Patrick Tang as vice president and general manager of the Asia region...
Suss Bonding System Chosen for Infotonics' MEMS Center
Mar 27, 2007 — Microelectromechanical systems (MEMS) wafer-bonding solutions provider Suss MicroTec of Munich, Germany, announced today that Infotonics has selected the company's ABC200 wafer-bonding cluster tool and FC150 device bonder for its MEMS packaging lab....
News Briefs
Nov 7, 2005 — Woodbury, N.Y.-based Veeco Instruments Inc., a provider of solutions for nanoscale applications in the worldwide data storage, LED/wireless, semiconductor and scientific research markets, has promoted two executives responsible for the company's...
NEXX Systems Acquires All Wet Technologies
Apr 23, 2003 — WILMINGTON, Mass., April 23 -- NEXX Systems, a Wilmington manufacturer of flip chip processing equipment for back-end semiconductor manufacturing, announced today it has completed the acquisition of All Wet Technologies Inc. (AWT), a Wellesley...
(8 results found)
April 2024
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