Cleaving Substrates for Photonics Technologies - New Downsizing Methods for Glass and SapphireLatticeGear designs, manufactures, and sells cleanroom compatible benchtop tools for downsizing a wide variety of substrates, both crystalline and amorphous, including silicon, GaAs, InP, sapphire, and glass. When developing tools and processes, we learned that scribing parameters such as scribe angle and depth are critical to the quality of the cleave. For crystalline materials, one must understand the crystal structure to predict the cleaving behavior. For all materials, substrate thickness,...