Glass technology company 3D Glass Solutions (3DGS) has closed a $30 million series C financing round. 3DGS said it will use the funding to increase its U.S.-based manufacturing capacity for high-volume production of 3D integrated passives and substrate products. The company develops and produces glass-based 3D integrated passive solutions using a patented low-loss photosensitive glass ceramic technology. 3DGS’ system-in-package devices and components are designed for radio frequency, photonics, and data center applications, including those in the 5G, aerospace, health care, and autonomous driving sectors. The round was led by Walden Catalyst Ventures, with participation from existing investors including Intel Capital and Lockheed Martin Ventures. Lip-Bu Tan, chair of Walden International and founding managing partner of Walden Catalyst Ventures, will join the 3DGS board of directors. After securing a licensing agreement with Corning for process and know-how related to forming through glass vias (TGV) in Corning high-purity fused silica, as well as a corresponding long-term supply agreement for glass wafers, 3DGS last year raised $4 million in an extended series B1 funding round. The company also inked a long-term supply agreement with Menlo Microsystems.