Materials and optoelectronic component manufacturer II-VI Inc. has completed the first phase of a joint research program with the University of South Florida (USF) to develop a new technology platform using thin-film diamond on silicon that will enable next-generation, high-speed electronic components in 5G wireless handsets. “II-VI is a leader in engineered materials and thin-film technologies for communications,” said Wen-Qing Xu, general manager of platform technology development and incubation at II-VI. “Our work with USF accelerates the development timelines and...Read full articleRelated content from Photonics MediaARTICLESWavefront Flipping Could Boost Internet SpeedsA technique developed at the University of Rochester “flips” the optical wavefront of an image for both polarizations simultaneously, so that it can be transmitted through a multimode...Photonics.com 5/14/2021II-VI Advances Diamond Platform, Electronics Sector PresenceII-VI has formed a collaboration with Element Six, a provider of synthetic diamonds and superhard materials, to expand the Pittsburgh-based engineered materials and optoelectronic components...Photonics Spectra April 2022 IssueNSF Allots Nearly $18M for Semiconductor FabEngineering researchers at the University of Arkansas received $17.87 million from the NSF to build and operate a national silicon carbide research and fabrication facility. 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Reynard focuses on manufacturing the highest quality products with...Photonics Buyers' GuideOpto Diode CorporationOpto Diode Corporation (Camarillo, CA), an ITW Company, delivers industry-leading sensors, photodiodes, IR detectors, photonic modules,assemblies, and LEDs. Available in standard and custom designs,...Photonics Buyers' GuideBuhler Inc., Business Area Leybold OpticsManufactures and supplies optical coating and ion beam figuring systems with processes for precision optics and optoelectronics. Coating technologies include ion beam sputtering (IBS), Plasma...Photonics Buyers' Guide