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II-VI, USF Complete First Phase of Thin-Film Partnership

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Materials and optoelectronic component manufacturer II-VI Inc. has completed the first phase of a joint research program with the University of South Florida (USF) to develop a new technology platform using thin-film diamond on silicon that will enable next-generation, high-speed electronic components in 5G wireless handsets. “II-VI is a leader in engineered materials and thin-film technologies for communications,” said Wen-Qing Xu, general manager of platform technology development and incubation at II-VI. “Our work with USF accelerates the development timelines and...Read full article

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