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Shaping Up Carbon Nanotubes

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TROY, N.Y., June 13, 2007 -- A new method boosts the density of carbon nanotube bundles by five to 25 times, creating efficient conductors that could one day replace copper as the primary interconnects used on computer chips and even hasten the transition to next-generation 3-D stacked chips. James Jian-Qiang Lu, associate professor of physics and electrical engineering at Rensselaer Polytechnic Institute (RPI), together with his research associate Zhengchun Liu, decided to investigate how to “densify” carbon nanotube bundles after they are already grown. The team discovered that by immersing vertically...Read full article

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