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Tech workshop focuses on PIC packaging

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Packaging for photonic integrated circuits continues to evolve, despite challenges. For silicon photonics, some of the potential solutions include wafer-level methods and “microbench” technologies for multichip device packaging. Since photonics does not yet have the volume to drive the need for cost-effective packages, it is possible that a drive for nonhermetic approaches may be one of the better solutions. That was the audience consensus at the EPIC technology workshop on Photonic Integrated Circuits Packaging Standardization, hosted in June at the TE Connectivity facility in...Read full article

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