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PI Physik Instrumente - 50 ways hexapod LB 5/24
Photonics Marketplace
13 products

Optical Fabrication Accessories

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UNIBOND 8.5 Thermoplastic Adhesive
UNIBOND 8.5 Thermoplastic Adhesive
Universal Photonics Inc.
  • Type: Adhesives
  • Color: Green
  • Melting Point (°C): 77 - 85
  • Penetration Test (in): 0.003 - 0.005
UNIBOND 6.5 Thermoplastic Adhesive
UNIBOND 6.5 Thermoplastic Adhesive
Universal Photonics Inc.
  • Type: Adhesives
  • Color: Orange
  • Melting Point (°C): 57 - 65
  • Penetration Test (in): 0.010 - 0.020
S3 Super Smooth Surfactant
S3 Super Smooth Surfactant
Universal Photonics Inc.
  • Type: Additives
  • Appearance: Pale Blue Liquid
  • pH: 6.0 - 7.5
  • Size Availability: 1pt, 1gl, 5gl
CP PITCH for Continuous Polishing
CP PITCH for Continuous Polishing
Universal Photonics Inc.
  • Type: Polishing Pitch
  • CP55 Softening Point (°C): 52 - 55
  • CP64 Softening Point (°C): 68 - 72
  • CP73 Softening Point (°C): 77 - 80
HASTILITE Poly Silicon Polish
HASTILITE Poly Silicon Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Particle Size D50 (µm): 0.110 - 0.140
  • Particle Size D99 (µm): < 0.389
  • pH: 1 - 3
UNIBOND 5.0 Thermoplastic Adhesive
UNIBOND 5.0 Thermoplastic Adhesive
Universal Photonics Inc.
  • Type: Adhesives
  • Color: Purple
  • Melting Point (°C): 55 - 63
  • Penetration Test (in): < 0.004
Uniform Series Solid Glass Microspheres
Uniform Series Solid Glass Microspheres
Novum Glass LLC
  • Type: Other
DZr-P Zirconia Slurry
DZr-P Zirconia Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Color: Pink
  • Concentration: 25%
  • D50 (µm): 1.4 - 1.6
MappIR
MappIR
PIKE Technologies Inc.
  • Type: Other
TJX438 Ceria Slurry
TJX438 Ceria Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Concentration: 30%
  • D50 (µm): 0.5 - 0.7
  • D97: <4.0
TPJ825 Ceria Powder
TPJ825 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2/TREO: >60%
  • Concentration: 100%
  • D50 (µm): 1.2 - 1.6
TJP621 Ceria Powder
TJP621 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2: 65-72 %
  • Concentration: 100%
  • D50 (µm): 1.8 - 2.2
D605S Ceria Slurry
D605S Ceria Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Concentration: 50%
  • D50 (µm): 0.8 - 1.0
  • D97: 5.0
Optical Fabrication Accessories Products

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