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9 products

Optical Fabrication Accessories

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HASTILITE MOV 850
HASTILITE MOV 850
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Density (g/mL): 1.4 - 1.6
  • Particle Size D50 (μm): 0.3 - 0.5
  • Particle Size D99 (μm): < 2
Premier Product
CP PITCH for Continuous Polishing
CP PITCH for Continuous Polishing
Universal Photonics Inc.
  • Type: Polishing Pitch
  • CP55 Softening Point (°C): 52 - 55
  • CP64 Softening Point (°C): 68 - 72
  • CP73 Softening Point (°C): 77 - 80
UNICER 1000 Cerium Polish
UNICER 1000 Cerium Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Appearance: Off White, Powder
  • Cerium Oxide Content (%): ≥ 58
  • Particle Size D50 (μm): 0.8 - 2.0
HASTILITE Ceria-Base Polish
HASTILITE Ceria-Base Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Particle Count D50 (μm): 0.4 - 0.7
  • pH: 6 - 7
  • PO Density (g/mL): 1.50 - 1.68
TJX438 Ceria Slurry
TJX438 Ceria Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Concentration: 30%
  • D50 (µm): 0.5 - 0.7
  • D97: <4.0
TPJ825 Ceria Powder
TPJ825 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2/TREO: >60%
  • Concentration: 100%
  • D50 (µm): 1.2 - 1.6
TJP621 Ceria Powder
TJP621 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2: 65-72 %
  • Concentration: 100%
  • D50 (µm): 1.8 - 2.2
DZr-P Zirconia Slurry
DZr-P Zirconia Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Color: Pink
  • Concentration: 25%
  • D50 (µm): 1.4 - 1.6
D605S Ceria Slurry
D605S Ceria Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Concentration: 50%
  • D50 (µm): 0.8 - 1.0
  • D97: 5.0
Optical Fabrication Accessories Products


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