Request InfoEV Group (EVG)ST. FLORIAN, Austria, Jan. 22, 2021 — The EVG®320 D2W die preparation and activation system from EV Group GmbH is a hybrid die-to-wafer bonding activation solution designed to speed the deployment of 3D heterogeneous integration. Providing seamless integration with third-party die bonders, the system incorporates all critical pre-processing modules needed for D2W bonding including cleaning, plasma activation, die alignment verification, and other essential metrology applications. It can be operated as a standalone or integrated system. It enables new generations of devices and systems such as high-bandwidth...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra March 2024 IssueLayer Release SystemThe EVG®850 NanoCleave™ from EV Group is a system that enables nanometer-precision release of bonded, deposited, or grown layers from silicon carrier substrates. 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