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Flip-Chip Bonder

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SET Corp. SA
SAINT-JEOIRE, France, Dec. 9, 2019 — The NEO HB automatic flip-chip bonder from Smart Equipment Technology Corp. SA is designed for ± 1-µm, 3-σ post-bonding accuracy in standalone or full automatic mode. The system is suitable for direct hybrid bonding processes. The first of a new line dedicated entirely to production, the bonder combines high precision, flexibility, short cycle time, and creative design.See full product

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