Search
Menu
AdTech Ceramics - Ceramic Packages 1-24 LB

Integrated Circuit Multiproject Wafer Process

Facebook X LinkedIn Email
Request Info
CEA-Leti
GRENOBLE, France, Sept. 3, 2018 — Leti has announced a multiproject-wafer (MPW) process for the integrated-circuit industry, fabricating emerging nonvolatile memory OxRAM (oxide-based resistive RAM) devices on a 200-mm foundry base-wafer platform. Available on Leti’s 200mm CMOS line, the MPW service provides a comprehensive, low-cost way to explore techniques designed to achieve miniaturized, high-density components. Including Leti’s Memory Advanced Demonstrator (MAD) future mask set with disruptive OxRAM technology, Leti’s integrated silicon memory platform is developed for backend memories and...See full product

Related content from Photonics Media



    PRODUCTS


    ARTICLES


    PHOTONICS HANDBOOK ARTICLES


    WHITEPAPERS


    WEBINARS


    PHOTONICS DICTIONARY+ TERMS


    VIDEOS


    PHOTONICS BUYERS' GUIDE CATEGORIES


    COMPANIES


    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.