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Lambda Research Optics, Inc. - Limited Time Offer

Silicon Photonics Die Bonder

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MRSI Mycronic
The MRSI-S-HVM high-speed, flexible 0.5-μm die bonder from MRSI Systems is designed for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging. The die bonder is based on the high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics. It uses multiple levels of parallel processing and has a high level of flexibility for multiple die applications. Flexibility allows automatic switching between 0.5- and 1.5-μm accuracy modes. The 0.5- μm mode uses a real-time alignment mechanism facilitated by the on-axis z-force...See full product

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