Request InfoMRSI MycronicThe MRSI-S-HVM high-speed, flexible 0.5-μm die bonder from MRSI Systems is designed for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging. The die bonder is based on the high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics. It uses multiple levels of parallel processing and has a high level of flexibility for multiple die applications. Flexibility allows automatic switching between 0.5- and 1.5-μm accuracy modes. The 0.5- μm mode uses a real-time alignment mechanism facilitated by the on-axis z-force...See full productRelated content from Photonics MediaPRODUCTSPhotonics.com 3/28/2024Active AlignerThe MRSI-A-L from MRSI Systems is an active aligner for optical packing solutions including fiber and lens attachments for transceivers, silicon photonics, AWGs, lidar, and integrated optics. 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