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Laird Technologies Inc. Products
Printed Circuit Board Substrate
Jun 7, 2010 — Laird Technologies Inc. has released the enhanced Tlam SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The versatile, thermally enhanced PCB substrate system is designed for heat dissipation in bright and ultrabright LED module applications. The substrate provides eight to 10 times the heat dissipation as compared with conventional FR4-based PCBs, a key ability in keeping components cool. The boards are processed through standard pick-and-place surface mount...
Laird Technologies
Request info >
Ferrite Chip Beads
ST. LOUIS, Nov. 4, 2008 – A line of EIA 0201 Ferrite chip beads has been introduced by Laird Technologies Inc. to extend its existing 0402 and 3312 surface-mounted monolithic EMI suppression product families. The LI0201 chip beads offer smaller, miniature footprints ideal...
Laird Technologies
Request info >
METAL-CORE LAMINATE
May 1, 2008 — Laird Technologies Inc. has announced an environmentally friendly metal-core printed circuit board laminate to keep bright and ultrabright LED light engines burning uniformly as well as brighter and longer. The RoHS-compliant T-lam SS LLD has a...
Laird Technologies
Request info >
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April 2024
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