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Rudolph Technologies Products
Wafer Inspection System
WILMINGTON, Mass., Dec. 11, 2018 — The NovusEdge system from Rudolph Technologies Inc. is designed for edge, notch, and backside inspection of unpatterned wafers. The NovusEdge system meets the stringent new requirements for defect control at the edge and backside of wafers...
Onto Innovation
Request info >
Inspection and Metrology Systems
WILMINGTON, Mass., Sept. 16, 2016 — Rudolph Technologies Inc. has announced the Firefly and Dragonfly inspection and metrology systems for advanced semiconductor manufacturing. Both systems leverage newly designed optical and imaging systems optimized for defect type, size and maximum...
Onto Innovation
Request info >
Imperfection Detection Technology
WILMINGTON, Mass., July 18, 2016 — Rudolph Technologies Inc. has announced its patented Clearfind imperfection detection technology for advanced packaging inspection, which can identify organic defects that are difficult or impossible to see with conventional white-light imaging...
Onto Innovation
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Metrology Inspection Capability
WILMINGTON, Mass., April 28, 2016 — Rudolph Technologies Inc. has added high-speed 3D metrology capabilities to its NSX series of flexible inspection and measurement platforms for process development and control of die-level interconnects. The capability incorporates a...
Onto Innovation
Request info >
NSX 220 Macro Defect Inspection System
FLANDERS, N.J., Sept. 5, 2013 — Rudolph Technologies Inc. has added a streamlined version of its automated macro defect inspection and metrology systems to its NSX line. The NSX 220 was designed for inspection of wafers up to 300 mm at traditional semiconductor, MEMS and LED...
Rudolph Technologies Inc.
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NSX 320 Metrology System
FLANDERS, N.J., Aug. 7, 2013 — Rudolph Technologies Inc. has released three application-specific configurations of its NSX 320 automated macro-defect inspection system for wafer-level packaging, 2.5D interposers and 3DICs (3-D integrated circuits) using through-silicon via as...
Rudolph Technologies Inc.
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JetStep Panel Lithography System
FLANDERS, N.J., July 10, 2013 — Rudolph Technologies Inc.’s JetStep panel lithography system can process both glass and organic laminate panels for applications in semiconductor advanced packaging. The system combines LCD manufacturing with on-the-fly autofocus for...
Rudolph Technologies Inc.
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MetaPULSE FP Metrology System
FLANDERS, N.J., Aug. 8, 2012 — Rudolph Technologies Inc.’s MetaPULSE FP thin-film metrology system is used by manufacturers of flat panel displays for handheld mobile devices, such as tablets, electronic book e-readers and smartphones. The system uses proprietary PULSE...
Rudolph Technologies Inc.
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Wafer Inspection System
FLANDERS, N.J., Feb. 13, 2009 – Rudolph Technologies Inc. has announced that its NSX series wafer inspection system now includes WaferWoRx probing process analysis, which identifies the cause of probe test failure mechanisms, providing faster problem resolution and improved...
DigiPol Technologies
WAFER INSPECTION
Mar 1, 2003 — An automated inspection system for 200- and 300-mm wafers has been released by Rudolph Technologies Inc. The WaferView provides macrodefect inspection of wafer surfaces at throughputs of >100 wafers per hour. The company says the system's...
Rudolph Technologies Inc.
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(10 results found)
April 2024
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