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Suss MicroTec AG Products
MASK ALIGNER
Nov 1, 2008 — Suss MicroTec AG has released the third generation of its manual mask and bond aligner for industrial research and production applications. MA/BA8 Gen3 offers alignment accuracy down to <0.25 μm and easily processes virtually all kinds of wafer and substrate materials up to 200 mm. The high-resolution optics enables patterning of structures below 0.5 μm. The split-field microscope and eyepieces allow direct viewing and/or LCD flat screen options.
SUSS MicroTec SE
Request info >
COATING CLUSTER
Oct 1, 2007 — The Gamma XPress coating cluster for wafer bumping and for LED manufacturing applications has been launched by Suss MicroTec AG. It is offered in various configurations designed for specific applications such as gold bump coating, underbump metal or...
Focuslight Switzerland SA
Request info >
iVista Digital Microscope
GARCHING, Germany, July 23, 2007 -- Suss MicroTec AG said its new iVista high-resolution digital microscope significantly improves the productivity of operators and engineers -- who are increasingly faced with rapid device design changes that result in instruments with extremely...
SUSS MicroTec SE
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(3 results found)
April 2024
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