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inspection system News
Rudolph Wins Order for Inspection System
Sep 1, 2011 — Rudolph Technologies Inc. has received from an integrated circuit manufacturer the first order for its NSX 320 automated macro defect inspection system, designed for advanced packaging processes that use through silicon vias (TSVs) to connect multiple die in a single package. The system provides inspection capabilities for edge-trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames and other TSV-related processes. It incorporates proprietary XSoft system...
Rudolph Receives First Order for Macro Defect Inspection System
FLANDERS, N.J., June 15, 2011 — Rudolph Technologies Inc. has announced that it has received from an IC manufacturer the first order for its NSX 320 automated macro inspection system, designed for advanced packaging processes that use through silicon vias (TSV) to connect multiple...
Spectral reflectivity and interferometry for optical lens analysis
Jul 1, 2010 — There are more than 500 companies in the US alone that make optical equipment. The number of products with built-in lenses is increasing. Few cell phones or personal computers are sold today without a still or video camera included. We see the...
Rudolph Wins Patent Infringement Verdict
May 1, 2009 — A jury has awarded Rudolph Technologies Inc. of Minneapolis approximately $6.8 million in a patent infringement suit against Camtek Ltd. of Migdal Ha’Emeq, Israel. The jury ruled that all models of Camtek’s Falcon inspection system infringe upon...
Rudolph Technologies Secures RVSI Inspection IP, Assets
Mar 1, 2008 — Rudolph Technologies Inc. of Flanders, N.J., has acquired all intellectual property and selected assets from RVSI Inspection LLC of Hauppauge, N.Y. The New Jersey company provides process characterization equipment and software used in wafer...
Gigabit Ethernet Cameras Inspect Paper and Steel
Jun 1, 2007 — Paper and steel manufacturing pose a variety of challenges for inspection systems. Endless streams of material must be checked for flaws early on before the material is packaged, bundled or processed further. Material movement, surface texture and...
Agreement Signed by EV Group and McBain
Apr 1, 2007 — EV Group E. Thallner GmbH of St. Florian, Austria, has signed an agreement with McBain Instruments of Chatsworth, Calif., to handle worldwide distribution of its ZIII-NIR wafer inspection system. With the agreement, the European company said that it...
(7 results found)
April 2024
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