Register
Sign In
Subscribe
Advertise
Publications
Photonics Spectra
BioPhotonics
Vision Spectra
Photonics Showcase
Photonics Buyers' Guide
Photonics Handbook
Photonics Dictionary
Newsletters
Bookstore
News & Features
Latest News
Latest Products
Features
All Things Photonics Podcast
By Technology
Lasers & Light Sources
Optics
Materials & Coatings
Imaging
Sensors & Detectors
Test & Measurement
Integrated Photonics
Spectroscopy
Biophotonics
Machine Vision
Marketplace
Supplier Search
Product Search
Career Center
Webinars & Events
Webinars
Photonics Media Virtual Events
Industry Events Calendar
Resources
White Papers
Videos
Contribute an Article
Suggest a Webinar
Submit a Press Release
Subscribe
Advertise
Become a Member
Publications
Photonics Spectra
BioPhotonics
Vision Spectra
Photonics Showcase
Photonics Buyers' Guide
Photonics Handbook
Photonics Dictionary
Newsletters
Bookstore
News & Features
Latest News
Latest Products
Features
All Things Photonics Podcast
By Technology
Lasers & Light Sources
Optics
Materials & Coatings
Imaging
Sensors & Detectors
Test & Measurement
Integrated Photonics
Spectroscopy
Biophotonics
Machine Vision
Marketplace
Supplier Search
Product Search
Career Center
Webinars & Events
Webinars
Photonics Media Virtual Events
Industry Events Calendar
Resources
White Papers
Videos
Contribute an Article
Suggest a Webinar
Submit a Press Release
Subscribe
Advertise
Become a Member
Register
Sign In
submit press release
semiconductor packaging News
sp3 Diamond Awarded Thermal Management Patents
SANTA CLARA, Calif., Sept. 26, 2012 — Diamond products and deposition equipment supplier sp3 Diamond Technologies Inc. has received two patents for technology that makes semiconductor and laser packaging more reliable.
Reflex Photonics Moves Headquarters
May 1, 2008 — Reflex Photonics, originally of Montreal, a developer of optical connectivity solutions for semiconductor packaging and data transfer applications, has moved its headquarters to Mountain View, Calif. The relocation allows the company direct access...
Scott Pringle to Direct Sales at Indium
Apr 19, 2007 — Scott Pringle was named sales director for global accounts at Indium Corp., the company announced today. Pringle has been a consultant with Indium for two years and has over 25 years of experience in the electronics market. He is based in southern...
Indium Promotes Ross Berntson
Apr 10, 2007 — Ross Berntson, director of Indium Corp.'s solder products unit, was promoted to vice president of the unit, the company announced today. He will oversee sales and technical services for markets including printed circuit board assembly,...
Indium Corp. Adds Surcharge on Silver- and Tin-Containing Products
Apr 3, 2007 — Electronics assembly and semiconductor packaging materials supplier Indium Corp. of Clinton, N.Y., yesterday announced a surcharge on its silver- and tin-containing solder paste products, effective immediately. Since January 2006 tin prices have...
Henkel Electronics Group Sets Up R&D Center
Mar 1, 2005 — The electronics group of Henkel Corp. has established a 53,000-sq-ft facility in Irvine, Calif., to house both research and development and applications engineering for its die attach, semiconductor underfill, encapsulant and semiconductor mold...
Daily News Briefs
Mar 12, 2004 — A report by SEMI and TechSearch International forecasts that the market for semiconductor packaging materials will grow from $7.9 billion in 2003 to $11.7 billion by 2008. The laminate substrates segment of the market, worth $2 billion globally in...
(7 results found)
April 2024
Subscribe
Advertise
Issue Library
Latest Products
Quantum Dot SWIR Sensor
Quantum Solutions
Three-Axis Stages
Optimal Engineering Systems Inc.
Surface-Mount MiniLEDs
Vishay Intertechnology Inc.
Wavefront Phase Camera
Wooptix
Robotic Guidance Vision Solution
Teledyne FLIR Integrated Imaging Solutions
Ultraviolet Camera
XIMEA GmbH
100W LED Pattern Projectors
Opto Engineering S.p.A.
AI Imaging Video Processor
Teledyne FLIR
Optical CMM 3D Scanners
Creaform Inc.
Wireless 3D Scanner
Scantech (Hangzhou) Co. Ltd.
Features
3D-Stacked CMOS Sparks Imaging’s Innovation Era
Photonics Spectra
, Apr 2024
Software-Defined Photonics Orchestrates Light in Future Data Centers
Photonics Spectra
, Apr 2024
A Quantum Leap for Sensitive Gas Analysis
Photonics Spectra
, Apr 2024
Explore Our Content
News
Features
Latest Products
Webinars
White Papers
All Things Photonics Podcast
Videos
Our Summits & Conferences
Industry Events
Bookstore
Join Our Community
Subscribe
Advertise
Become a member
Sign in
Contribute a Feature
Suggest a Webinar
Submit a Press Release
Mobile Apps
About Us
Our Company
Our Publications
Contact Us
Career Opportunities
Teddi C. Laurin Scholarship
Terms & Conditions
Privacy Policy
California Consumer Privacy Act (CCPA)
©2024 Photonics Media
100 West St.
Pittsfield, MA, 01201 USA
[email protected]
We use cookies to improve user experience and analyze our website traffic as stated in our
Privacy Policy
. By using this website, you agree to the use of
cookies
unless you have disabled them.