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materials Products
TEMPORARY ADHESIVE
Dec 1, 2002 — Aremco Products Inc. has released Crystalbond 555, a thermoplastic adhesive for temporary mounting of ceramic substrates, semiconductor devices and optical crystals that require dicing or polishing. The adhesive also bonds to glass and metal and is transparent in thin cross sections, which enables users to observe the part during processing. It flows at 120 °F, dissolves in hot water and is suitable for low-shear machining applications and for filling gaps and grooves in components that...
Aremco Products Inc.
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CO2 LASER
Oct 1, 2002 — The Fantom F250 from Laser Photonics Corp. is a 250-W sealed CO2 laser for materials processing at a rate equal to that of a 700-W laser at 10.6 µm. This RF-excited laser uses slab-type technology with an intracavity mode-selection system...
Laser Photonics Corp.
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EPOXY ADHESIVE
Oct 1, 2002 — EP75-1 from Master Bond Inc. is a two-component, graphite-filled, electrically conductive adhesive with a 100:15 mix ratio by weight. The company says it is easy to apply, exhibits minimal sagging and dripping, even on vertical surfaces, and adheres...
Master Bond Inc.
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UV CURING ADHESIVE
Oct 1, 2002 — ÅngströmBond AB9031 from Fiber Optic Center Inc. is a low-stress, epoxy-based, ultraviolet curing adhesive that bonds to metal, ceramic, silicon, plastic and glass. It contains an advanced optical silica filler that contributes to low...
Fiber Optic Center Inc.
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UV-CURABLE ADHESIVE
Sep 1, 2002 — Master Bond Inc.'s UV14-3 single-component flexible UV adhesive cures in seconds to 1 min, depending on the intensity of the UV light. Appropriate for curing in thick and thin sections, the adhesive has low viscosity and requires no mixing. The...
Master Bond Inc.
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ADHESIVE DISPENSING
Aug 1, 2002 — The Mikros pen from EFD Inc. is suitable for dispensing two-part epoxies, ultraviolet-cure adhesives and other high-performance assembly fluids, while reducing waste. It features a disposable 0.25-cc fluid reservoir tip that attaches to a...
Nordson EFD
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ADHESIVE DISPENSING PEN
Apr 1, 2002 — The MicroPen from EFD Inc. is a dispensing tool for use in fiber optic assembly processes that require precise amounts of two-part epoxies and UV-cure adhesives. It produces deposits down to 0.004 in. in diameter, without the waste associated with...
Nordson EFD
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FO ADHESIVES
Apr 1, 2002 — Dymax Corp. has released a line of adhesives for fiber optic assembly, including fixturing and positioning adhesives, adhesives with refractive indices from 1.42 to 1.58 for use in the optical pathway, and adhesives with shrinkage as low as 0.1%....
Dymax, Headquarters
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OXIDE SINGLE CRYSTALS
Apr 1, 2002 — Stoichiometric LiNbO3 and LiTaO3 single crystals grown by Oxide Corp. have applications in optical storage, telecommunications and frequency doubling with parametric conversion. Unlike congruently grown crystals, which are usually deficient in...
Oxide Corp.
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Light-Curing Systems and Light-Curable Adhesives and Epoxy
Feb 11, 2002 — Electro-Lite will introduce two new products at OFC 2002: The ELC-450 microprocessor-based light-curing system offers high-intensity UV spot-curing capability. The standard package includes an 8mm optical diameter quartz rod light guide. For...
Electro-Lite Corp.
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CONNECTOR ADHESIVE
Feb 1, 2002 — AngströmBond AB9320 is a two-part blue epoxy designed for terminating multimode, single-mode and multifiber connectors. Fiber Optic Center Inc. says this low-stress adhesive does not cause fiber core cracking or fiber pistoning. It can be cured...
Fiber Optic Center Inc.
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DWDM SUBSTRATES
Feb 1, 2002 — Plan Optik GmbH produces precision glass substrates from 4 to 12 in., with thicknesses up to 35 mm. The DWDM substrates are available in a wide range of materials, including fused silica, BK 7, F 7 and K-Lc. The company says the low roughness and...
Plan Optik AG
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UV-CURABLE ADHESIVE
Jan 1, 2002 — Dexter Electronic Materials offers a low-viscosity UV-light-cure adhesive for optical pathway bonding applications. Hysol UV 702 wicks into and fills gaps of <25 µm and cures in seconds upon high-intensity UV exposure. The adhesive forms an...
Dexter Research Center Inc.
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UV ADHESIVE
Oct 1, 2001 — Master Bond Inc. has introduced a single-component, high-viscosity, optically clear adhesive that matches the refractive index of glass (1.46). UV15-7LRI cures at room temperature when exposed to UV light, even in the presence of air. It forms...
Master Bond Inc.
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UV EPOXY
Oct 1, 2001 — Electronic Materials Inc. has released Optocast 3580 and 3590 curable epoxies with refractive indexes of 1.4823 and 1.550, respectively. They contain no monomers, have no odor and are nontoxic. These clear, low-viscosity liquids cure to a tough,...
Electronic Materials Inc.
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HIGH-HEAT ADHESIVE
Sep 1, 2001 — Aremco Products Inc. has developed Ceramabond 618, a high-temperature, silica-based ceramic adhesive for bonding low-expansion ceramics, glasses and quartz. It is used in the assembly of infrared heaters and instruments such as temperature probes...
Aremco Products Inc.
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ADHESIVE DISPENSER
Aug 1, 2001 — The 2000XL adhesive dispenser from EFD Inc. uses microprocessor circuitry for fiber optic assembly operations where accurate and consistent application of adhesives and epoxies is critical. Applications include bonding fibers to ferrules, sealing...
Nordson EFD
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EPOXY ADHESIVE
Aug 1, 2001 — Master Bond Inc. has developed a two-component epoxy adhesive for high-performance bonding applications such as potting and encapsulating electronic components and bonding optical elements. The company says EP30 offers low viscosity, outstanding...
Master Bond Inc.
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CERAMIC ADHESIVE
May 1, 2001 — A high-temperature adhesive for bonding and potting high-wattage quartz halogen lamps is available from Aremco Products Inc. Ceramabond 835M is an alumina-filled, water-based formulation that also bonds to ceramic and metallic bases. It is suitable...
Aremco Products Inc.
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CERAMIC ADHESIVE
Apr 1, 2001 — A high-temperature adhesive for bonding and potting high-wattage quartz halogen lamps is available from Aremco Products Inc. Ceramabond 835M is an alumina-filled, water-based formulation that also bonds to ceramic and metallic bases. It is suitable...
Aremco Products Inc.
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DRYING/CURING
Apr 1, 2001 — A hot-plate accessory from Specialty Coating Systems dries and cures photoresists, epoxies and other thermally cured or solvent-based materials applied to flat substrates, such as spin-coated wafers. Designed for use with the company's line of...
Specialty Coating Systems Inc.
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UV ADHESIVE
Apr 1, 2001 — Fiber Optic Center Inc. designed its low-viscosity UV cure adhesive for bonding glass, ceramic and silicon substrates in applications that require no shrinkage. AngstromBond AB9047 cures in <10 s with a 400-W lamp and, because it is...
Fiber Optic Center Inc.
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HEAT-CURE EPOXY
Feb 1, 2001 — Optocast 3663 is a one-component heat-cure epoxy designed for fiber optic applications such as aligning, fixturing and sealing. Available from Electronic Materials Inc., it is a 10:1 epoxy that features 85/85 resistance, a pot life of 3 months at...
Electronic Materials Inc.
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OPTICAL ADHESIVES
Feb 1, 2001 — Dymax Corp. offers its 140 series of UV/VIS light-curing adhesives for optical applications in medical devices that require Class VI biocompatibility. The company says these single-component medical optic adhesives produce high strength, stress-free...
Dymax, Headquarters
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CLEAR ADHESIVE
Jan 1, 2001 — EP30-3 is an epoxy adhesive, sealant and encapsulant featuring high-temperature resistance, low viscosity and a noncritical 100- to 30-mix ratio by weight. This optically clear, two-component system from Master Bond Inc. has a service operating...
Master Bond Inc.
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May 2024
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