Ultrafast Lasers Sharpen the Success of Physical Failure Analysis
In recent years, lasers have made significant inroads into analytical applications, such as semiconductor test and analysis. They are now incorporated into analytical instruments, for example, to detach single atoms from a tiny tip, or to measure a sample’s structure. In semiconductor physical failure analysis (PFA), lasers are used to selectively remove material that encapsulates the die in the semiconductor package to allow for the die to be taken for subsequent analysis — a process known as...
Photonics Spectra, July 2023