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Hamamatsu Corp. - Fast Quantum Cascade Detector

Low-Threshold SWIR Imaging with Quantum Dot Sensors

Jul 21, 2022
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ABOUT THIS WEBINAR
Vision applications have been dominated by silicon (Si)-based image sensors, which are perfectly suited for visible and near-infrared (NIR) wavelengths up to ~1 µm. Shortwave infrared (SWIR) is typically affordable only for high-end use cases, due to the very high cost of InGaAs-based hybrid imagers. The use of monolithic sensors based on thin-film photodetectors with a quantum dot (QD) absorber layer has recently gained ground in machine vision applications. Integration directly on CMOS readout circuits allows for small pixel pitch (<2 µm), high resolution (multimegapixel), and even range extension into extended SWIR (>1.6 µm). These features, along with promising orders-of-magnitude price reduction with high volumes, promise game-changing SWIR image sensors, not only for machine vision but also for consumer and automotive systems. Malinowski provides an overview of QD sensor technology and its ecosystem, and includes some highlights from imec's latest camera demonstrators.

***This presentation premiered during the 2022 Vision Spectra Conference. For more information on Photonics Media conferences, visit events.photonics.com.

About the presenter:
Pawel MalinowskiPawel E. Malinowski was born in Lodz, Poland, in 1982. He received a Master of Science in engineering degree in electronics and telecommunications from the Lodz University of Technology in 2006. His master’s thesis was on the design of radiation-tolerant integrated circuits. In 2011, Malinowski received a doctorate in electrical engineering from KU Leuvenin in Belgium. His doctorate thesis was on III-nitride-based imagers for space applications.

Malinowski has worked at imec since 2005 and in the Large-Area Electronics department, currently the Sensor and Actuator Technologies department since 2011. He is program manager of pixel innovations, and he focuses on disruptive optical sensor technologies, including new types of image sensors enabled by thin-film semiconductor integration. Malinowski oversees innovation initiatives, works closely with tech teams, creates technology roadmaps, and prepares go-to-market strategies.

He has co-authored articles for more than 50 publications and submitted six patent applications. He was a recipient of the International Display Workshops Best Paper Award in 2014 and the SID Display Week Distinguished Paper Award in 2018. He co-supervised the work leading to the I-Zone Best Prototype Award at the Society for Information Display (SID) Display Week in 2019. Malinowski is a member of IEEE and SID, and he served on the ODI (Optoelectronics, Displays, and Imagers) Committee of the 64th and 65th IEDM (International Electron Devices Meeting) conference. He is currently a member of the program committee for the SEMI Connecting Heterogeneous Systems Summit. He has been an evaluator for EC-MSCA (the European Commission’s Marie Sklodowska-Curie Actions) since 2019.
Sensors & Detectorsimagingmachine visionVision SpectraSWIR imagingquantum dot
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