Analysis of Metallic Impurities in Organic Solvents Used in IC Fabrication With ICP-MS

Facebook X LinkedIn Email
Author: Kyoko Kobayashi and Ewa Pruszkowski
Thursday, February 4, 2021

Even though Integrated Circuit (IC) fabrication takes place inside the highly controlled cleanroom environment, contaminants from process chemicals, such as Isopropyl alcohol, account for over 50% of Integrated Circuits' production losses. Chemical producers continually strive to deliver organic solvents with lower levels of contaminants. In this application note, we look at the analyses of 46 elements in three different solvents.

Download Application Note
File: NexION_5000_ICP_MS.pdf (1.66 MB)
To download this application note, please complete the *required fields before clicking the "Download" button.
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:

When you click "Download", you agree that your personal contact information may be shared with PerkinElmer and they may contact you about their products and services in the future. You also agree that Photonics Media may contact you with information related to this request, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required
Materials & Chemicalssemiconductorsmetallic impuritiesorganic solventsintegrated circuitsintegrated photonics
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.