Request InfoSUSS MicroTec SESuss MicroTec AG has released the third generation of its manual mask and bond aligner for industrial research and production applications. MA/BA8 Gen3 offers alignment accuracy down to <0.25 μm and easily processes virtually all kinds of wafer and substrate materials up to 200 mm. The high-resolution optics enables patterning of structures below 0.5 μm. The split-field microscope and eyepieces allow direct viewing and/or LCD flat screen options.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra May 2024 IssueMicrospectrometersThe Lightblades™ Spectrometers from CRAIC Technologies are specifically designed for microspectroscopy in research, industrial, and academic applications. Covering ultraviolet, visible, and...Photonics.com 9/8/2022Zoom Microscope LensThe BS-1085 4K Apochromatic Monocular Zoom Microscope Lens from BestScope International Ltd. features an adopted apochromatic optical system. 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