Teledyne DALSA - Line Scan Leader 5/24 LB

22 products

Photonics Products

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HASTILITE MOV 850
Universal Photonics Inc.

Type: Polishing Material and Pads
Density (g/mL): 1.4 - 1.6
Particle Size D50 (μm): 0.3 - 0.5
Particle Size D99 (μm): < 2

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EVERFLO Surfacing Additive
Universal Photonics Inc.

Type: Additives
Density (g/mL): 0.95 - 1.00
Freezing Point (°F): 26 - 28
pH: 6.4 - 8.6

3M TRIZACT Diamond Tile Abrasive Pad
Universal Photonics Inc.

Type: Abrasives
Available Grades (µ): 3, 6, 9
Customization: Yes
PSA Backing: Yes

Submerged Polisher
Universal Photonics Inc.

Type: Polishing
Width: 1.2m
Height: 1.6m
Length: 1.2m
Compressed Air: No
Control Panel: PLC Touch-Screen
Customizable: Yes

PM-KB™ Keyboard Testing Software
Radiant Vision Systems, Test & Measurement

Type: Test and Measurement
Camera: ProMetric Imaging System
Dimensional Inspection: Presence, position, match
Output: Luminance, Chromaticity

UNICER 1000 Cerium Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
Appearance: Off White, Powder
Cerium Oxide Content (%): ≥ 58
Particle Size D50 (μm): 0.8 - 2.0

SC-955 PAD
Universal Photonics Inc.

Type: Polishing Material and Pads
Density (g/cm3): 0.30 - 0.42
PSA Backing: Yes
Removal Rate (µm/min): 0.68

HASTILITE Poly Silicon Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
Particle Size D50 (µm): 0.110 - 0.140
Particle Size D99 (µm): < 0.389
pH: 1 - 3

HASTILITE Nano Silicon Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
% Solids: 15 - 20
Particle Size D50 (μm): 0.110 - 0.140
Particle Size D99 (μm): < 0.389

HASTILITE Ceria-Base Polish
Universal Photonics Inc.

Type: Polishing Material and Pads
Particle Count D50 (μm): 0.4 - 0.7
pH: 6 - 7
PO Density (g/mL): 1.50 - 1.68

KGG-IPLA Goggles
Kentek Corporation

Type: Safety Glasses
Standards: Meets ANSI Z80, ANSI Z87 and CE EN166.

Domaille APM-HDC-5400 Programmable Polishing Machine
Fiber Optic Center Inc.

Type: Other

APD10G1
Albis Optoelectronics AG

Type: Photodiodes
Light Spectrum: NIR
Optical damage threshold: up to +5 dBm
Receiver sensitivity: –34.5 dBm
Responsivity: 10 A/W

unity
Aurox Ltd.

Type: Optical
Size: 482 × 222 × 399 mm
Weight: 20 kg

TJX438 Ceria Slurry
Demeter Technologies Inc.

Type: Polishing Material and Pads
Concentration: 30%
D50 (µm): 0.5 - 0.7
D97: <4.0

TPJ825 Ceria Powder
Demeter Technologies Inc.

Type: Polishing Material and Pads
CeO2/TREO: >60%
Concentration: 100%
D50 (µm): 1.2 - 1.6

TJP621 Ceria Powder
Demeter Technologies Inc.

Type: Polishing Material and Pads
CeO2: 65-72 %
Concentration: 100%
D50 (µm): 1.8 - 2.2

DZr-P Zirconia Slurry
Demeter Technologies Inc.

Type: Polishing Material and Pads
Color: Pink
Concentration: 25%
D50 (µm): 1.4 - 1.6

D605S Ceria Slurry
Demeter Technologies Inc.

Type: Polishing Material and Pads
Concentration: 50%
D50 (µm): 0.8 - 1.0
D97: 5.0

PF32
Photon Force Ltd.

Type: CMOS
Max. Resolution: 1KP
Sensor Width (pixels): 32
Sensor Height (pixels): 32
Interface: USB 3.0
Spectral Range: VIS,NIR
Dark Count Rate Per Pixel: ≤100 Hz
FPS: 300000
Single-photon Sensitivity: ≅30 %

Microgage PRO
Pinpoint Laser Systems

Type: Diode
Max. Power: 1mW
Classification (IEC): Class 3R
Wavelength: 635nm
Wavelength - Tunable?: No
Operating Mode: Continuous
Beam Diam.: 2mm
Laser Accuracy: <2 arcsec
Laser Repeatability: <1 arcsec
Measurement Accuracy: ±0.0002" or 1% of meas. (5 µm)

CEX - 100
LDI Innovation OU

Type: Gas
Max. Power: 500mW
Classification (IEC): Class 3B
Wavelength: 157 - 351nm
Wavelength - Tunable?: No
Operating Mode: Pulsed
Max. Pulse Rate: 100Hz
Dimensions (L × W × H): 346 × 149 × 232 mm
External Trigger: yes
Weight: 9.2 kg

Photonics Products

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