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Intel Sells Minority Stake in IMS Nanofabrication

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Intel will divest an approximately 20% stake in its IMS Nanofabrication GmbH business to Bain Capital in a transaction that values IMS at approximately $4.3 billion. The transaction is expected to close in the third quarter of 2023. IMS will operate as a stand-alone subsidiary and will continue to be led by CEO Elmar Platzgummer.

IMS Nanofabrication’s multi-beam mask writing technology is used for the extreme ultraviolet (EUV) lithography processes that are used in semiconductor production. IMS debuted a commercial multi-beam mask writer in 2015, the same year Intel acquired the company and six years after it made its initial investment in IMS. 

“Since the acquisition, IMS has delivered a significant return on investment to Intel while growing its workforce and production capacity by four times and delivering three additional product generations,” Intel said in a press release. The company said that as the broad adoption of EUV technology into leading-edge technologies continues, the multi-beam mask writing tools required to create advanced EUV masks are increasingly critical to the semiconductor manufacturing ecosystem. According to Intel, the sale to Bain Capital will serve as an investment, enabling IMS to capture significant market opportunity for multi-beam mask writing tools by accelerating innovation and enabling deeper cross-industry collaboration.

The divestment comes amid a week of activity for Intel in which the company announced investments to build semiconductor manufacturing facilities in Poland, Germany, and Israel, and released its 12-qubit silicon chip to the quantum research community.

Published: June 2023
Lithography is a key process used in microfabrication and semiconductor manufacturing to create intricate patterns on the surface of substrates, typically silicon wafers. It involves the transfer of a desired pattern onto a photosensitive material called a resist, which is coated onto the substrate. The resist is then selectively exposed to light or other radiation using a mask or reticle that contains the pattern of interest. The lithography process can be broadly categorized into several...
extreme ultraviolet
Extreme ultraviolet (EUV) refers to a specific range of electromagnetic radiation in the ultraviolet part of the spectrum. EUV radiation has wavelengths between 10 and 124 nanometers, which corresponds to frequencies in the range of approximately 2.5 petahertz to 30 exahertz. This range is shorter in wavelength and higher in frequency compared to the far-ultraviolet and vacuum ultraviolet regions. Key points about EUV include: Source: EUV radiation is produced by extremely hot and energized...
BusinesssemiconductorsLaserslithographychipsmanufacturingfabricationnanofabricationmulti beamEUVextreme ultravioletAmericasEuropeacquisitionsalesellminority stakeIntelIMS NanofabricationBain CapitalIndustry News

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