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Espros, Benewake Partner for 3D Time-of-Flight Sensor Chips in Lidar

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Espros Photonics AG and Benewake Co. Ltd. have signed a frame agreement for the supply of 3D time-of-flight sensor chips for robotics and autopilot vehicles. A team of Benewake engineers visiting Espros Headquarters in Sargans, Switzerland. Courtesy of Espros. This frame order concludes an engineering cooperation between both companies. Espros has matured the sensitivity of the epc600 and epc610 chip product family while Benewake has developed the DE LiDAR, which is applied to obstacle avoidance, simultaneous localization and mapping (SLAM), and artificial intelligence applications....Read full article

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