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Optical Fabrication Accessories

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HASTILITE MOV 850
HASTILITE MOV 850
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Density (g/mL): 1.4 - 1.6
  • Particle Size D50 (μm): 0.3 - 0.5
  • Particle Size D99 (μm): < 2
Premier Product
CP PITCH for Continuous Polishing
CP PITCH for Continuous Polishing
Universal Photonics Inc.
  • Type: Polishing Pitch
  • CP55 Softening Point (°C): 52 - 55
  • CP64 Softening Point (°C): 68 - 72
  • CP73 Softening Point (°C): 77 - 80
UNIBOND 8.5 Thermoplastic Adhesive
UNIBOND 8.5 Thermoplastic Adhesive
Universal Photonics Inc.
  • Type: Adhesives
  • Color: Green
  • Melting Point (°C): 77 - 85
  • Penetration Test (in): 0.003 - 0.005
UNIBOND 6.5 Thermoplastic Adhesive
UNIBOND 6.5 Thermoplastic Adhesive
Universal Photonics Inc.
  • Type: Adhesives
  • Color: Orange
  • Melting Point (°C): 57 - 65
  • Penetration Test (in): 0.010 - 0.020
S3 Super Smooth Surfactant
S3 Super Smooth Surfactant
Universal Photonics Inc.
  • Type: Additives
  • Appearance: Pale Blue Liquid
  • pH: 6.0 - 7.5
  • Size Availability: 1pt, 1gl, 5gl
EVERFLO Surfacing Additive
EVERFLO Surfacing Additive
Universal Photonics Inc.
  • Type: Additives
  • Density (g/mL): 0.95 - 1.00
  • Freezing Point (°F): 26 - 28
  • pH: 6.4 - 8.6
High and Low Refractive Index Adhesives
High and Low Refractive Index Adhesives
Norland Products Inc.
  • Type: Adhesives
X-59 Strip Coating
X-59 Strip Coating
Universal Photonics Inc.
  • Type: Other
  • Color: Black
  • Full Dry Time (hr): 24
  • Size Availability: 1gl
UNICER 1000 Cerium Polish
UNICER 1000 Cerium Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Appearance: Off White, Powder
  • Cerium Oxide Content (%): ≥ 58
  • Particle Size D50 (μm): 0.8 - 2.0
SC-955 PAD
SC-955 PAD
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Density (g/cm3): 0.30 - 0.42
  • PSA Backing: Yes
  • Removal Rate (µm/min): 0.68
HASTILITE Poly Silicon Polish
HASTILITE Poly Silicon Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • Particle Size D50 (µm): 0.110 - 0.140
  • Particle Size D99 (µm): < 0.389
  • pH: 1 - 3
HASTILITE Nano Silicon Polish
HASTILITE Nano Silicon Polish
Universal Photonics Inc.
  • Type: Polishing Material and Pads
  • % Solids: 15 - 20
  • Particle Size D50 (μm): 0.110 - 0.140
  • Particle Size D99 (μm): < 0.389
UNIBOND 5.0 Thermoplastic Adhesive
UNIBOND 5.0 Thermoplastic Adhesive
Universal Photonics Inc.
  • Type: Adhesives
  • Color: Purple
  • Melting Point (°C): 55 - 63
  • Penetration Test (in): < 0.004
Gugolz Polishing Pitch
Gugolz Polishing Pitch
Meller Optics Inc.
  • Type: Polishing Pitch
  • Burn Point: 278° to 252°
  • Flash Point: 246° to 213°
  • Melting Point: 72°C to 87°C
Test Plates
Test Plates
Rainbow Research Optics LLC
  • Type: Other
  • Concave Available: Yes
  • Convex Available: Yes
  • Diameter Up To: 6"
Uniform Series Solid Glass Microspheres
Uniform Series Solid Glass Microspheres
Novum Glass LLC
  • Type: Other
Optical Adhesives - OP-29
Optical Adhesives - OP-29
Dymax, Headquarters
  • Type: Adhesives
  • Durometer Hardness: D60
  • Elongation at Break, %: 110
  • Glass Transition Tg, °C: 64
Optical Alignment Adhesives - OP-60
Optical Alignment Adhesives - OP-60
Dymax, Headquarters
  • Type: Adhesives
  • CTE: 58 × 10 - 6 in/in/°C (58 ppm)
  • Durometer Hardness: D80
  • Elongation at Break, %: 2.4
Optical Positioning Epoxy - OP-81-LS
Optical Positioning Epoxy - OP-81-LS
Dymax, Headquarters
  • Type: Adhesives
  • Durometer Hardness: D90
  • Elongation at Break, %: 2
  • Glass Transition, Tg °C: 153
Camera Module Optical Epoxy - 9803
Camera Module Optical Epoxy - 9803
Dymax, Headquarters
  • Type: Adhesives
  • Durometer Hardness: D94
  • Elongation at Break, %: 1.2
  • Glass Transition, Tg °C: 1.84
MappIR
MappIR
PIKE Technologies Inc.
  • Type: Other
Nanoimprint Mold
Nanoimprint Mold
NTT Advanced Technology Corp.
  • Type: Other
Generation and Polish of Large Optics
Generation and Polish of Large Optics
Electrogrip
  • Type: Other
Ceramic Materials
Ceramic Materials
Glen Mills Inc.
  • Type: Other
TPJ825 Ceria Powder
TPJ825 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2/TREO: >60%
  • Concentration: 100%
  • D50 (µm): 1.2 - 1.6
TJP621 Ceria Powder
TJP621 Ceria Powder
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • CeO2: 65-72 %
  • Concentration: 100%
  • D50 (µm): 1.8 - 2.2
DZr-P Zirconia Slurry
DZr-P Zirconia Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Color: Pink
  • Concentration: 25%
  • D50 (µm): 1.4 - 1.6
D605S Ceria Slurry
D605S Ceria Slurry
Demeter Technologies Inc.
  • Type: Polishing Material and Pads
  • Concentration: 50%
  • D50 (µm): 0.8 - 1.0
  • D97: 5.0
Optical Fabrication Accessories Products


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