Request InfoPlan Optik AGPlan Optik AG has expanded its range of carriers for the handling of semiconductor wafers and substrates of nonstandard shapes and sizes for processes related to semiconductors and microelectromechanical systems (MEMS). The process carriers consist of either surface-processed silicon wafers or a combination of a blank silicon wafer with a bonded glass carrier on top. They are available in many combinations (300 to 200 mm, 200 to 150 mm, etc.) and can also accommodate multiple small substrates (e.g. four 3-in. wafers on one 200-mm carrier, or hundreds of smaller sizes such as 10 ×...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra April 2024 IssueCompact VIS-SWIR CameraThe Emberion VS20 Compact from Emberion is a lightweight camera consisting of VGA resolution over a broad spectral range from visible to short-wave infrared wavelengths in room temperature operation....BioPhotonics Nov/Dec 2022 IssueRadiation-Resistant Optical FiberThe Optran® UV NSS Fiber from Armadillo SIA provides deep-UV solarization and radiation resistance. The optical fiber features a hermetic carbon layer, low numerical aperture expansion, and...BioPhotonics Sep/Oct 2022 IssueCooled CMOS CameraThe ChemiMOS 9.0 cooled CMOS camera from Atik Cameras Ltd. is optimized for long-exposure imaging. 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