Register
Sign In
Subscribe
Advertise
Publications
Photonics Spectra
BioPhotonics
Vision Spectra
Photonics Showcase
Photonics Buyers' Guide
Photonics Handbook
Photonics Dictionary
Newsletters
Bookstore
News & Features
Latest News
Latest Products
Features
All Things Photonics Podcast
By Technology
Lasers & Light Sources
Optics
Materials & Coatings
Imaging
Sensors & Detectors
Test & Measurement
Integrated Photonics
Spectroscopy
Biophotonics
Machine Vision
Marketplace
Supplier Search
Product Search
Career Center
Webinars & Events
Webinars
Photonics Media Virtual Events
Industry Events Calendar
Resources
White Papers
Videos
Contribute an Article
Suggest a Webinar
Submit a Press Release
Subscribe
Advertise
Become a Member
Publications
Photonics Spectra
BioPhotonics
Vision Spectra
Photonics Showcase
Photonics Buyers' Guide
Photonics Handbook
Photonics Dictionary
Newsletters
Bookstore
News & Features
Latest News
Latest Products
Features
All Things Photonics Podcast
By Technology
Lasers & Light Sources
Optics
Materials & Coatings
Imaging
Sensors & Detectors
Test & Measurement
Integrated Photonics
Spectroscopy
Biophotonics
Machine Vision
Marketplace
Supplier Search
Product Search
Career Center
Webinars & Events
Webinars
Photonics Media Virtual Events
Industry Events Calendar
Resources
White Papers
Videos
Contribute an Article
Suggest a Webinar
Submit a Press Release
Subscribe
Advertise
Become a Member
Register
Sign In
submit press release
paper News
CEA-Leti, Intel Advance Die-to-Wafer Self-Assembly Process
SAN DIEGO, June 6, 2022 — CEA-Leti reported the optimization of a hybrid direct-bonding, self-assembly process with the potential to increase the alignment accuracy as well as fabrication throughput of die-to-wafer (D2W) bonding. The work is part of a collaboration with Intel. The progress is described in a paper presented at the 2022 Electronic Components and Technology Conference, titled “Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration.” The
D-Wave Systems Publishes Quantum Computer Study
BURNABY, British Columbia, Sept. 24, 2018 — Quantum computing systems developer D-Wave Systems Inc. has published a study demonstrating a topological phase transition using its 2048-qubit annealing quantum computer. This complex quantum simulation of materials is a major step toward reducing...
3-D Optical Microscopy Expands Applications
Dec 1, 2011 — High-speed operation has enabled the 3-D optical microscope to transition successfully from a precision laboratory instrument to a rugged, frontline industrial tool for quality control and process-monitoring applications in diverse industries....
Keithley Offers Webinar on Measuring Electrical Resistivity
CLEVELAND, Nov. 16, 2010 — Keithley Instruments, which specializes in advanced electrical test instruments and systems, will broadcast a free web-based seminar titled “How to Make Electrical Resistivity Measurements of Bulk Materials: Conductors, Insulators, and...
Licensing Agreement
Jul 1, 2010 — Terahertz research company T-Ray Science Inc. has granted a licensing agreement to Toptica Photonics Inc. of Victor, N.Y., a terahertz source supplier. Under terms of the agreement, T-Ray will collect royalties on US sales of Toptica’s...
Paper Becomes Power Source
TROY, N.Y., Aug. 15, 2007 -- By weaving black carbon nanotubes into paper, engineers have created printable, flexible batteries that are more resilient than many existing batteries, yet can be cut, folded and worked just like paper. The rechargeable material could find uses in...
$100M Raised to Manufacture Plastic Semiconductors
CAMBRIDGE, England, Jan. 11, 2006 -- Plastic Logic announced last week that it has raised $100 million to fund construction of the first factory to manufacture semiconductors out of plastic instead of silicon. The facility will produce flexible active-matrix display modules for use in...
Nanobattery Project Paper Published
Dec 21, 2005 — LITTLE FALLS, N.J., Dec. 21 -- Scientists from mPhase Technologies and Lucent Technologies Bell Labs have demonstrated a working reserve nanotechnology-based battery that could be the prototype for a new generation of batteries that are lighter...
Low-Power Lasers Make Their Mark
Mar 1, 2004 — Although sealed CO2 lasers have been used to mark plastics, paper and other organic materials for years, two recent areas of growth include the marking of metals and glass — applications once considered the domain of other, often higher-cost...
(9 results found)
April 2024
Subscribe
Advertise
Issue Library
Latest Products
Surface-Mount MiniLEDs
Vishay Intertechnology Inc.
Wavefront Phase Camera
Wooptix
Robotic Guidance Vision Solution
Teledyne FLIR Integrated Imaging Solutions
Ultraviolet Camera
XIMEA GmbH
100W LED Pattern Projectors
Opto Engineering S.p.A.
AI Imaging Video Processor
Teledyne FLIR
Optical CMM 3D Scanners
Creaform Inc.
Wireless 3D Scanner
Scantech (Hangzhou) Co. Ltd.
Imaging Colorimeter
Radiant Vision Systems, Test & Measurement
OSFP Transceiver
Approved Networks
Features
3D-Stacked CMOS Sparks Imaging’s Innovation Era
Photonics Spectra
, Apr 2024
Software-Defined Photonics Orchestrates Light in Future Data Centers
Photonics Spectra
, Apr 2024
A Quantum Leap for Sensitive Gas Analysis
Photonics Spectra
, Apr 2024
Explore Our Content
News
Features
Latest Products
Webinars
White Papers
All Things Photonics Podcast
Videos
Our Summits & Conferences
Industry Events
Bookstore
Join Our Community
Subscribe
Advertise
Become a member
Sign in
Contribute a Feature
Suggest a Webinar
Submit a Press Release
Mobile Apps
About Us
Our Company
Our Publications
Contact Us
Career Opportunities
Teddi C. Laurin Scholarship
Terms & Conditions
Privacy Policy
California Consumer Privacy Act (CCPA)
©2024 Photonics Media
100 West St.
Pittsfield, MA, 01201 USA
[email protected]
We use cookies to improve user experience and analyze our website traffic as stated in our
Privacy Policy
. By using this website, you agree to the use of
cookies
unless you have disabled them.