Register
Sign In
Subscribe
Advertise
Publications
Photonics Spectra
BioPhotonics
Vision Spectra
Photonics Showcase
Photonics Buyers' Guide
Photonics Handbook
Photonics Dictionary
Newsletters
Bookstore
News & Features
Latest News
Latest Products
Features
All Things Photonics Podcast
By Technology
Lasers & Light Sources
Optics
Materials & Coatings
Imaging
Sensors & Detectors
Test & Measurement
Integrated Photonics
Spectroscopy
Biophotonics
Machine Vision
Marketplace
Supplier Search
Product Search
Career Center
Webinars & Events
Webinars
Photonics Media Virtual Events
Industry Events Calendar
Resources
White Papers
Videos
Contribute an Article
Suggest a Webinar
Submit a Press Release
Subscribe
Advertise
Become a Member
Publications
Photonics Spectra
BioPhotonics
Vision Spectra
Photonics Showcase
Photonics Buyers' Guide
Photonics Handbook
Photonics Dictionary
Newsletters
Bookstore
News & Features
Latest News
Latest Products
Features
All Things Photonics Podcast
By Technology
Lasers & Light Sources
Optics
Materials & Coatings
Imaging
Sensors & Detectors
Test & Measurement
Integrated Photonics
Spectroscopy
Biophotonics
Machine Vision
Marketplace
Supplier Search
Product Search
Career Center
Webinars & Events
Webinars
Photonics Media Virtual Events
Industry Events Calendar
Resources
White Papers
Videos
Contribute an Article
Suggest a Webinar
Submit a Press Release
Subscribe
Advertise
Become a Member
Register
Sign In
submit press release
packaging News
Critical Tech, Policy Priorities at the Fore of Second SPIE Summit
WASHINGTON, D.C., Oct. 2, 2023 — Policymakers and appointed officials outlined many of the U.S. government’s foremost priorities in science and technology, joining with leaders from the photonics sector in Washington, D.C., last week for the second SPIE Photonics Industry Summit. The one-day summit placed a premium on using industry collaboration to help spur economic and technological advancement, with additional focus on workforce development and education. The event built on last year’s inaugural Industry
Five Common Design Mistakes Can Send PIC Packaging Costs Skyrocketing
Sep 1, 2023 — We have all heard that photonic integrated circuits (PICs) can pack a ton of functionality into high-performance, energy-efficient, and low-cost microchips, as well as the promise that they will enable a revolution of powerful optoelectronic devices...
Lumibird to Acquire Convergent Photonics from Prima Industrie
LANNION, France, May 16, 2023 — Laser developer Lumibird has signed an agreement to acquire Convergent Photonics, a subsidiary of Italian company Prima Industrie, as well as the Convergent assets of Prima Industrie North America. Convergent is a designer and manufacturer of...
Zebra Technologies Acquires Matrox Imaging
LINCOLNSHIRE, Ill., March 15, 2022 — Zebra Technologies will acquire Matrox Imaging, the Montreal-based provider of machine vision components and systems and a division of Matrox Electronic Systems Ltd. The $875 million deal marks the mobile computing company’s third major...
AIM Photonics Awarded $321M from Air Force, SUNY
ALBANY, N.Y., Oct. 25, 2021 — AIM Photonics has signed a seven-year agreement with the Air Force Research Laboratory (AFRL) and the Research Foundation of the State University of New York. The agreement includes support totaling more than $321 million. The funding includes $165...
ODT Reveals Insights into Promising Substitute for Petroleum-Based Plastics
DAEJEON, South Korea, Aug. 4, 2021 — Using 3D optical diffraction tomography (ODT), scientists at KAIST (formerly the Korea Advanced Institute of Science and Technology) gained insight into how the biodegradable polyester polyhydroxyalkanoate (PHA) accumulates in the cells of living...
PODIUM Consortium Will Develop Integrated Photonics Solution
NIJMEGEN, Netherlands, Dec. 15, 2020 — Chip Integration Technology Center (CITC), Tegema, Physik Instrumente (PI), and PHIZ announced a photonics assembly consortium called PODIUM (PIC Open Development Infrastructure for Universal Markets). The consortium is funded by PhotonDelta and...
All-Glass Fiber Optic Sensor Measures Force on Miniature Objects
WASHINGTON, D.C., Sept. 10, 2020 — A team of researchers has designed a tiny fiber optic force sensor, approximately equal in diameter to a human hair, capable of measuring extremely slight forces exerted by small objects. The light-based sensor is made of silica glass formed into a...
Swansea University, Crown Holdings Enter Smart Factory Project Collaboration
SWANSEA, Wales, Feb. 8, 2019 — Next-generation smart factories, which use advanced digital technology to improve efficiency, are the focus of a collaboration between packaging manufacturer Crown Holdings Inc. and Swansea University. Swansea’s Cinzia Giannetti at the College of...
Palomar Technologies Meets ISO Standards
CARLSBAD, Calif., Oct. 17, 2018 — Photonic and microelectronic device packaging solutions provider Palomar Technologies has been certified as meeting the International Organization for Standardization (ISO) 9001:2015 standards for its corporate offices. The audit was performed by...
Singapore’s A*Star Forms Consortia to Advance IC Packaging
SINGAPORE, July 15, 2016 — Singapore’s Agency for Science, Technology and Research (A*STAR) Institute of Microelectronics (IME) has reported the creation of two consortiums with a number of semiconductor companies to develop cost-effective 2.5D and 3D wafer-level integrated...
Rudolph to Fulfill $11M Wafer-Level Packaging System Order
WILMINGTON, Mass., July 4, 2016 — Defect inspection, lithography, metrology, and process control software developer Rudolph Technologies Inc. said it has received a multisystem order for its fan-out wafer level packaging (FOWLP) system from an outsourced assembly and test firm in...
Optical Sensors Speed Up Production Lines
Sep 1, 2013 — Recent advances in optical sensors enable the industry to monitor manufacturing processes on line in real time at a very fast rate. Optical sensors are not only essential for safety on the production line, but they are also fast becoming an...
Smaller Pump Laser Packaging Announced
Dec 1, 2012 — An agreement between optical communications products suppliers Oclaro Inc. of San Jose, Calif., and 3SPGroup of Nozay, France, marks the biggest change in industry standards for small form factor pump laser packaging in 15 years, reducing the...
Suppliers Agree to Smaller Pump Laser Packaging
SAN JOSE, Calif., Sept. 12, 2012 — An agreement announced Wednesday between optical communications products suppliers Oclaro Inc. and 3SPGroup marks the biggest change in industry standards for small form factor (SFF) pump laser packaging in 15 years, reducing the packaging by 70...
Light Converts 2-D Patterns into 3-D Objects
RALEIGH, N.C., Nov. 14, 2011 — Two-dimensional patterns that can self-fold into 3-D objects using only light have generated a breakthrough that could have applications in manufacturing processes or packaging. The technique takes a prestressed plastic sheet — made from the...
EU Project Opens Doors for Optical Chips
EINDHOVEN, The Netherlands, Nov. 2, 2010 — In October, Eindhoven saw the kick-off of the international R&D project Paradigm (Photonic Advanced Research and Development for Integrated Generic Manufacturing). Led by Eindhoven University of Technology, the project is intended to standardize...
Uncooled IR cameras and detectors: Costing less, scaling up
LYON, France – Prices of uncooled IR detectors and cameras are falling, thanks to numerous technological and business developments. Driven by this cost reduction, the market volume for thermography and IR vision will triple by 2015, according to Yole...
Sick To Host Forum in Atlanta Sept. 22
MINNEAPOLIS, Sept. 16, 2010 — Sensors, safety systems and automatic identification products manufacturer Sick announced the 2010 Sick Solutions Forum in Atlanta at the Atlanta Northeast hotel Sept. 22, 2010. The forum will include free seminars designed to help attendees...
EU Consortium Tackles Power Consumption
IPSWICH, England, Aug.12, 2010 — A Europe-wide consortium will work to make a significant impact on the power consumption of telecommunications and data networks, which are estimated to consume as much as 3 percent of European electricity. Five organizations have come together in...
Laser pavilion at electronica and productronica 2010 India
Jul 7, 2010 — I am not sure how many readers are aware, but Messe München International has been organizing the electronica India and productronica India shows. In fact, this year’s edition is slated to held from Sept. 7 to 10 at the sprawling...
GigOptix Launches ‘Sunset Rescue’ Program
PALO ALTO, Calif., May 7, 2010 — A service that provides replacements for obsolete application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs) using a methodology owned by GigOptix Inc. through its acquisition of ChipX in November 2009 was announced....
SRC, UNT Establish Semiconductor Center
RESEARCH TRIANGLE PARK, N.C. and DENTON, Texas, March 25, 2010 – Semiconductor Research Corp. (SRC), a university-research consortium for semiconductors and related technologies, and the University of North Texas (UNT) announced the formation of a new research center that focuses on advanced plasma processes and...
Karnataka Semicon Policy Presents Opportunities for Green Electronics Makers
Feb 23, 2010 — It has really been a busy month for me, given that a lot of activities have been happening in India alone, not to speak of the other parts of the world. Well, this is great, as it ...
Nothhaft to Lead Tessera Board
Jan 4, 2010 — Tessera Technologies Inc. of San Jose, Calif., announced today that President and CEO Henry R. Nothhaft was appointed chairman of its board, effective Jan. 1. Formerly the vice chairman, Nothhaft succeeds Bruce McWilliams, who served as chairman...
1
2
>
(35 results found)
May 2024
Subscribe
Advertise
Issue Library
Latest Products
AI SoCs
Ambarella Inc.
AI Vision Development Kit
Prophesee SA
Industrial Automation Solutions
Zebra Technologies Inc.
High-Power Supercontinuum Laser
SuperLight Photonics BV
Twin Table Laser System
eurolaser GmbH
Measurement Vision System
Bowers Group
Smart Camera Solutions
Pekat Vision
MicroLED Sputtering System
Singulus Technologies AG
Radiometric Camera Platform
Teledyne DALSA, Machine Vision OEM Components
Quantum Dot SWIR Sensor
Quantum Solutions
Features
Rare-Earth Doped Fibers Deliver Critical Elements to Dynamic Systems
Photonics Spectra
, May 2024
Bottlenecks in Process and Production Hinder Micro-LED Adoption
Photonics Spectra
, May 2024
Beam Deflection Units Increase the Efficiency of Laser Powder Bed Fusion
Photonics Spectra
, May 2024
Explore Our Content
News
Features
Latest Products
Webinars
White Papers
All Things Photonics Podcast
Videos
Our Summits & Conferences
Industry Events
Bookstore
Join Our Community
Subscribe
Advertise
Become a member
Sign in
Contribute a Feature
Suggest a Webinar
Submit a Press Release
Mobile Apps
About Us
Our Company
Our Publications
Contact Us
Career Opportunities
Teddi C. Laurin Scholarship
Terms & Conditions
Privacy Policy
California Consumer Privacy Act (CCPA)
©2024 Photonics Media
100 West St.
Pittsfield, MA, 01201 USA
[email protected]
We use cookies to improve user experience and analyze our website traffic as stated in our
Privacy Policy
. By using this website, you agree to the use of
cookies
unless you have disabled them.